7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics
5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
ABB KU C711 AE GATE UNIT POWER S GUSP KUC711AE
KU C755 AE Subboard PCB assembled varn KUC755AE
ABB KU C755 AE108 GATEUNITPWRSUPPLY KUC755AE108
UFC911B106 CVMI2B BOARD UF C911 B106
ABB UFC911B110 printed boards UF C911 B110
UFC911B108 Printed circuit board UF C911 B108
UFC921A101 Board Varnished UF C921 A101
UF C784 AE101 | ABB | UFC784AE101 electronic module
UF C911 B101 ASEA BROWN BOVERI UFC911B101
UF C760 BE43 | ABB | UFC760BE43 MAIN CIRC. INTER
UF C784 AE | ABB | UFC784AE Controller module
UF C765 AE02 | ABB | UFC765AE02 Frequency converter module
UF C760 BE45 | ABB | UFC760BE45 PHASE MODULATOR
UF C766 AE01 | ABB | UFC766AE01 MAIN CIRC. INTER.
UF C760 BE42 | ABB | UFC760BE42 MAIN CIRC. INTER.
UF C766 AE01 | ABB | UFC766AE01 VOLTAGE/CURRENT M ADCVI
UF C760 BE41 | ABB | UFC760BE41 MAIN CIRCUIT INTE
UF C721 AE | ABB | UFC721AE VOLTAGE/CURRENT M ADCVI
UF C911 B110 | ABB | UFC911B110 CVMI2B BOARD
UF C762 AE101 | ABB | UFC762AE101 Medium and high voltage module
UF C921 A101 | ABB | UFC921A101 INT-2 Board Varnished
UF C760 BE141| ABB | UFC760BE141 INTERFACE BOARD
UF C760 BE141| ABB | UFC760BE141 INTERFACE BOARD
UF C765 AE102 | ABB | UFC765AE102 EAF-BOARD COATED
UF C760 BE143 | ABB | UFC760BE143 INTERFACE BOARD
UF C718 AE101 | ABB | UFC718AE101 MAIN CIRCUIT INTE INT
UF C718 AE101 | ABB | UFC718AE101 MAIN CIRCUIT INTE INT
UF C719 AE | ABB | UFC719AE I/O CONTROLBOARDS IOEC
UF C762 AE | ABB | UFC762AE CVMI-BOARD
UF C718 AE01 | ABB | UFC718AE01 MAIN CIRCUIT INTE INT
UF C760 BE145 | ABB | UFC760BE145 PHASE MODULATOR
UF C718AE | ABB | UFC718AE INT-BOARD JUMPER
UF C721 BE101 | ABB | UFC721BE101 ADCVI-Board Coat
UF C719 AE| ABB | UFC719AE I/O CONTROLBOARDS IOEC
UF C921 A103 | ABB | UFC921A103 BOARD MEGASTAR
UF C762 AE | ABB | UFC762AE 3BHE006412R0001 CVMI-BOARD
UF C718 AE01 | ABB | UFC718AE01 MAIN CIRCUIT INTE INT
UF C911 B104 | ABB | UFC911B104 CVMI2B
UFC784AE101 | ABB | UF C784 AE101 FSCD-BOARD,COATED
UF C760 BE42 | ABB | UFC760BE42 MAIN CIRC. INTER
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