Description
PFEA113-65 3BSE028144R65 Использование параметров ABB
Швейцария, и входит в десятку крупнейших швейцарских транснациональных корпораций.PFEA113-65 3BSE028144R65
химическая, нефтехимическая, фармацевтическая, целлюлозно – бумажная, нефтепереработка; Оборудование приборов: электронные приборы, телевизоры и оборудование для передачи данных,
генераторы, гидротехнические сооружения; Каналы связи: интегрированные системы, системы сбора и распространения;PFEA113-65 3BSE028144R65Строительная промышленность: коммерческое и промышленное строительство.
(3)Market size:
(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng
(5) Recommendation index: Recommended
4. Switching power supply
5. Power factor correction technology
6. Application of power electronics technology in power systems
7. LED driver power supply
8. Other applications
[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan
Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada
Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying
Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan
Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2
. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…
1. IC design companies
1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera
2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .
3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin
Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology,
BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics,
Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.
2. Semiconductor materials companies
1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries,
Applied Materials
2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin,
Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy,
Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese
company), Guosheng
Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics,
Jianghua Micro, Jin Ruihong, etc.
3. Semiconductor equipment manufacturing companies
1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike,
Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.
2. Heat treatment equipment: Applied Materials, ASM
3. Ion implantation equipment: Applied Materials
4. CVD/PECVD/ALD equipment:
5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics
6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen
7. Coating/Developing Equipment: DNS, EV Group, Suss Mi
3500/53M Electronic Overspeed Detection System
A6140 9199-00058 emerson Digital I/O module
3500/32 4-channel relay module
3500/45 4-channel Position Monitor
3500/05-02-02 Axial displacement probe
A6220 9199-00009 EMERSON Ethernet module
135489-04 I/O Module With Internal Barriers And Internal Terminations
136703-01 3500/50 I/O Module with Internal Barriers and Internal Termination
135473-01 Proximitor/Seismic Monitor Module
125840-01 High Voltage AC Power Input Module
133396-01 Overspeed Detection I/O Module
138708-01 Shaft Absolute I/O Module with Internal Terminations
125760-01 Data Manager I/O Module
A6370D EMERSON Analog quantity input card
125680-01 Proximitor I/O Module
330980-51-05 XL NSv Proximitor Sensor
330850-90-05 3300 XL 25 mm Proximitor Sensor
136180-01 Communication Gateaway Module
149369-01 Enhanced Keyphasor Module
133388-01 3500/53 Overspeed Detection Module
A6410 EMERSON Output module
127610-01 3500/15 AC Power Supply Module
176449-02 Proximitor/Seismic Monitor
125744-02 Rack Interface Module
125712-01 4-Channel Relay Module
133388-02 3500/50 Tachometer Module
A6500-RC EMERSON System Relay Card
163179-01 Temperature Monitors
A6500-UM EMERSON Monitoring module
138607-01 3500/22M Standard Transient Data Interface Module
176449-01 Proximitor Monitor
A6824R EMERSON Analog input module
CE4001S2T2B4 EMERSON Digital input module
CE4003S2B1 EMERSON Motherboard processor module
CE4003S2B6 EMERSON Function analog module
FX-316 Emerson processor
KJ2003X1-BA2 EMERSON
KJ2003X1-BB1 EMERSON Processor module
KJ2201X1-HA1 EMERSON Simplex SLS Terminal Block
KJ3002X1-BF1 EMERSON RTD Card
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