G3ESa HENF318736R1 Multifunctional control board

Product parameters

Model: G3ESa HENF318736R1

Brand: ABB

Size: 10cm x 10cm x 30cm

Weight: 1.2KG

Color: White Black

Working voltage: 5V

Working temperature: -10 ℃ to 50 ℃

Communication interface: RS232, RS485, CAN

Product specifications

Support for MODBUS protocol

Support hardware flow control

Using high-speed CMOS devices

Support for data caching

application area

G3ESa HENF318736R1 is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.

G3ESa HENF318736R1 is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals

Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment

Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc

Model: G3ESa HENF318736R1 Brand: ABB Archive Function: Communication Function Product Certification: Qualified

Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type

Number of screens: 4 Imported or not: Yes Customized for processing: No

Alarm function: Product name: Module Input voltage: 24V Rated current: 5A

Special service: including postage. Remarks: one-year warranty. Operation method: remote control

Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut

Power voltage: 220V Input method: Current Input Material code: 65218

Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication

Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm

Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1

Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2

Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported

Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed

Third party communication products: ABB controllers available for sale in: nationwide

Product Instructions

Please install G3ESa HENF318736R1 correctly on the device and connect the communication interface cable properly.

Please refer to the user manual for operating G3ESa HENF318736R1 to ensure proper use.

Product Introduction

G3ESa HENF318736R1 is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.

Taiwan panel manufacturer: The main ones include Chimei-Innolux, AUO, Chunghwa Picture Tubes, Hannstar Color Crystal,
Tongbao, Jinxiang, Guanghui, ORTUSTECH, Quantai Jingxiang, Lianyou, Qijing, Daji, Jingcai, Jingda , Zhongfu, Jiuzheng Optoelectronics
, Guanglian, Youjing, Taisheng, Fuxiang, Zhichi, Rhenium Technology, Nanya Optoelectronics, etc.
Touch chip manufacturers: Atmel, BYD Microelectronics, Cypress, Duntai, Mstar, Goodix Technology, Synaptics, Siliwei, Junyao ,
Xunjun, Jichuang North, Silicon Innovation, Betley, Lianye, Qijing, Yili, Mefasi, Zhidachuang, Solomon Islands, Haier, Shengli, etc. 14.
Touch screen manufacturers in the mobile phone touch industry chain: 3M, LG Innotek, Fujitsu, Nissha, Sharp, OFILM, Truly, Born
Optical, China Yili, TPK, Shenyue Optoelectronics, Holita, Yeji, Ultrasound, Leybold, Yanghua, Lianchuang, Shengda, Junda, Dijing,
Dept, Junda, Concern, Yushun, Huaruichuan, Xuding, Huaxingda, Tianyi, Oreden, Hangtai, Wanjing, Zhihengzhuo, Pingbo, Xingzhan, Zhonghai
, Diren, Dixian, Akita Wei, Deyi, Puda, Dunzheng, Weiguangjun, Yucheng, Caitongda , Baoming, Shengnuo, BOE, Zhengxing, Hongzhanguang,
CSG, Puxing, Biotech, Shitong, Yuye, Beitai Display, etc.
15. Connector supply chain
Foreign connector giants: Tyco Electronics, Molex, Amphenol, FCI, Sentech, Jae, 3M, Yazaki, JST, Phoenix, Delphi, KET, Panasonic
Electric Works, Hirose Electric, Sumitomo Electrical, Weidmüller, Harding, Ranhu Electronics, Odu, etc.
Chinese connector giants: Luxshare Precision, AVIC Optoelectronics, Changying Precision, Derun Electronics, Sunsea Communications,
Aerospace Electrical Appliances, Wutong Holdings, Yonggui Electrical Appliances, Ruibao Co., Ltd., Sichuan Huafeng, Aerospace Electronics
, Foxconn, Shiying Co., Ltd., Lianzhan Technology, Hechang, Zhengwei, etc.
16. LED chip supply chain
In recent years, mainland LED manufacturers have risen rapidly, helping China become the world”s largest LED chip manufacturer.
At present, the global LED chip market is mainly divided into three camps: Japanese, European and American manufacturers are the first camp,
South Korea and Taiwan are the second camp, and mainland manufacturers are the third camp.
17. Foreign LED chip manufacturers
Nichia Chemical (Japan), Toyoda Gosei (Japan), Cree (USA), Osram (Germany), Agilent (USA), Toshiba (Japan), Lumen (headquartered in the
United States, acquired by Philips ), Seoul Semiconductor (South Korea), Showa Denko (Japan), Asahi Ming (USA), etc.
Domestic LED chip/packaging manufacturers: Mainland Chinese companies mainly include Sanan Optoelectronics, Tongfang Optoelectronics
, Huacan Optoelectronics, Qianzhao Optoelectronics, Dehao Runda, Aoyang Shunchang, Silan Mingxin, Yuanrong Optoelectronics, Blu-ray
Technology, and Ledman Optoelectronics , Sapphire Optoelectronics, Furi Electronics, Crystal Blue Optoelectronics, Hunan Hualei, Jucan Optoelectronics,
Jingneng Optoelectronics, Jinko Electronics, Fangda Group, Jingyu Optoelectronics, Hualian Electronics, Shengpu Optoelectronics, etc.
Taiwan: Mainly including Jingyuan Optoelectronics, Huashang Optoelectronics, Hejing Optoelectronics, Canyuan Optoelectronics, Taigu Optoelectronics, etc.
18.
Listed companies in the domestic sensor supply chain: Goertek Acoustics, Aerospace Electronics, Huatian Technology, Dongfeng Technology, Aerospace
Mechanical and Electrical, Tongding Internet, Huagong Technology, Kellu Electronics, Silan Micro, Robot, Unisplendour National Core, Suzhou Guoxin
Technetium, Hanwei Electronics, AVIC Electronics, Sannuo Biotech, Xinlian Electronics, Shanghai Belling, Jingfang Technology, Weltech, etc.
Foreign investments in China: Siemens Sensors and Communications (SSCL), SIK Sensors (Guangxi), Turck (Tianjin) Sensors, Meggitt (Xiamen),
MTS Sensors China, Balluff Sensors (Chengdu), Wegler Sensors (Shanghai), Delta Sensor (Changzhou), MD Sensor (Tianjin), etc.
19.
Cathode material manufacturers in the battery industry chain: Nichia Chemical, Toda Industry, Kiyomi Chemical, Tanaka Chemical, Mitsubishi Chemical,
L&F, UMICORE, Ecopro, A123, Valance, Saft, Hunan Shanshan, Peking University Xianxian, Dangsheng Technology, Bamo Technology, Hunan Ruixiang,
Ningbo Jinhe, Tianjiao Technology, Xiamen Tungsten Industry, Zhenhua New Materials, Qianyun Hi-Tech, etc.
Anode material manufacturers: Nippon Kasei, Nippon Carbon, JFE Chemical, Mitsubishi Chemical, Beterui, Shanghai Shanshan, Jiangxi Zichen,
Shenzhen Snow, Xingyuan Graphite, Jiangxi Zhengtuo, Huzhou Chuangya, Tianjin Jinmei, Chengdu Xing Neng et al.
Diaphragm manufacturers: Asahi Kasei, Celgard, Exxon-Tonen, Japan Ube, Sumitomo Chemical, SK, Xingyuan Materials, Zhongke Technology,
Jinhui Hi-Tech, Cangzhou Mingzhu, Henan Yiteng, Nantong Tianfeng, Donghang Optoelectronics, Hebei Jinli, Tianjin Dong Gao, Shandong Zhenghua, etc.
Electrolyte manufacturers: Xinzhoubang, Dofluoro, Mitsubishi Chemical, Fuji Pharmaceutical Industry, Mitsui Chemicals, Morita Chemical, Kanto
Denka, SUTERAKEMIFA, South Korea”s Samsung, Jiangsu Cathay, Tianjin Jinniu, Dongguan Shanshan, Guangzhou Tianci, Dongguan Kaixin,
Zhuhai Saiwei Electronics, Beijing Chemical Reagent Research Institute, Shantou Jinguang, Chaozhou Chuangya, etc.
20. Semiconductor discrete device manufacturers
At present, global semiconductor discrete devices are mainly monopolized by European, American, Japanese and other countries and regions,
especially in the high-end market, they have absolute say. Since domestic manufacturers have not yet formed scale effects and cluster effects, their
production is still based on the “OEM” model.
United States: The United States currently leads the world in semiconductor discrete devices, with a large number of discrete devices such as TI,
IR (International Rectifier), Diodes, Fairchild (acquired by ON), ON (On Semiconductor), Vishay, etc., which have absolute influence in the world. manufacturer. In
addition, American semiconductor manufacturers also have an absolute advantage in the field of power management chips, and their market customers are mainly
targeted at the Asia-Pacific market.
Europe: There are mainly world-renowned semiconductor manufacturers such as Infineon (Infineon), NXP (acquired by Qualcomm in the United States),
ST (STMicroelectronics), etc., with complete product lines, and leading capabilities in both IC and discrete devices. From the perspective of market customer distribution,
the Asia-Pacific region is also the largest application market for European manufacturers, followed by the European market.
Japan: Japan is also the main country in the world”s semiconductor discrete device manufacturers, mainly including Toshiba, Renesas, Rohm, Matsushita Fuji
and other semiconductor manufacturers. Japanese manufacturers have strong competitiveness in semiconductor discrete devices and have many manufacturers.
However, the core business of many manufacturers is not semiconductor discrete devices. In terms of overall market share, Japanese manufacturers lag behind American
manufacturers. Judging from the market customer distribution of Japanese manufacturers, Japan is its largest market, followed by the Asia-Pacific (excluding Japan) market, and it occupies
a small market share in the European and American markets.
Taiwan, China: Taiwan”s semiconductor discrete device chip and finished product market has developed rapidly in recent years, with manufacturers such as NichTek,
A-Power, Anpec, and SG. In terms of products, in addition to AC/DC products provided by Sungmao (SG), manufacturers in Taiwan mainly focus on the DC/DC field.
Their main products include linear voltage regulators and power MOSFETs. Overall, semiconductor discrete device manufacturers in Taiwan are developing rapidly,
and the gap between technology and leading international manufacturers has further narrowed. Their products are mainly used in equipment such as computer motherboards, graphics cards, and LCDs.
Mainland China: In recent years, the global voice of China”s semiconductor discrete devices has been steadily increasing, and it is now the world”s largest discrete
device market. Hong Kong, Taiwan, and South Korea are the main export markets for domestic semiconductor discrete devices, among which Hong Kong is the largest export
market. At present, Guangdong, Jiangsu, and Shanghai are firmly among the top three exporters of domestic semiconductor discrete devices, and the major domestic provinces
exporting semiconductor discrete devices are still dominated by coastal provinces.
Local discrete device manufacturers mainly include Yangjie Technology, Huawei Electronics, Suzhou Guzhi Technetium, Taiji Technology, Kaihong Technology,
Hualian Electronics, Leshan Radio, Huashan Electronics, Qinyi Electronics, Hill Electronics, Weiguang Technology, Liaoning Technology Crystal Electronics, Mingxin Microelectronics,
Yandong Microelectronics, Galaxy Century Microelectronics, Shenai Semiconductor, Aier Semiconductor, Yaguang Electronics, China Resources Microelectronics, Zhonghuan Semiconductor, Dongchen Electronics, etc.

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