Description
HE693CAN501D Horner Electric
высотой 3U, расположенный в раме управления под DSPX.
волоконно – оптический разъем на передней панели и передаются в модуль обнаружения заземления.
ABB: Запасные части для промышленных роботов серии DSQC, Bailey INFI 90, IGCT, например: 5SHY6545L0001 AC1027001R0101 5SXE10 – 0181, 5SHY3545 L0009, 5SHI3545L0010 3BHB013088 R0001 3BHE009681R0101 GVC750BE101, PM866, PM861K01, PM864, PM510V16, PPD512, PPPD113, PP836A, P865A, 877, PPP881, PPPP885, PPSL500000 4 3BHL00390P0104 5SGY35L4510 и т.д.
General Electric: запасные части, такие как модули, карты и приводы. Например: VMVME – 7807, VMVME – 7750, WES532 – 111, UR6UH, SR469 – P5 – HI – A20, IS230SRTDH2A, IS220PPDAH1B, IS215UCVEH2A, IC698CPE010, IS200SRTDH2ACB и т.д.
Система Bently Nevada: 350 / 3300 / 1900, предохранительные зонды и т.д., например: 3500 / 22M, 3500 / 32, 3500 / 15, 3500 / 23500 / 42M, 1900 / 27 и т.д.
Системы Invis Foxboro: Серия I / A, управление последовательностью FBM, трапециевидное логическое управление, обработка отзыва событий, DAC,
обработка входных / выходных сигналов, передача и обработка данных, такие как FCP270 и FCP280, P0904HA, E69F – TI2 – S, FBM230 / P0926GU, FEM100 / P0973CA и т.д.
Invis Triconex: Модуль питания, модуль CPU, модуль связи, модуль ввода – вывода, например 300830937214351B, 3805E, 831235114355X и т.д.
Вудворд: контроллер местоположения SPC, цифровой контроллер PEAK150, например 8521 – 0312 UG – 10D, 9907 – 149, 9907 – 162, 9907 – 164, 9907 – 167, TG – 13 (8516 – 038), 8440 – 1713 / D, 9907 – 018 2301A, 5466 – 258, 8200 – 226 и т.д.
Hima: модули безопасности, такие как F8650E, F8652X, F8627X, F8678X, F3236, F6217, F6214, Z7138, F8651X, F8650X и т.д.
Honeywell: Все платы DCS, модули, процессоры, такие как: CC – MCAR01, CC – PAIH01, CC – PAIH02, CC – PAIH51, CC – PAIX02, CC – PAON01, CC – PCF901, TC – CR014, TC – PD011, CC – PCNT02 и т.д.
Motorola: серии MVME162, MVME167, MVME172, MVME177, такие как MVME5100, MVME5500 – 0163, VME172PA – 652SE, VME162PA – 344SE – 2G и другие.
Xycom: I / O, платы VME и процессоры, такие как XVME – 530, XVME – 674, XVME – 957, XVME – 976 и т.д.
Коул Морган: Сервоприводы и двигатели, такие как S72402 – NANA, S6201 – 550, S20330 – SRS, CB06551 / PRD – B040SSIB – 63 и т. Д.
Bosch / Luxer / Indramat: модуль ввода / вывода, контроллер PLC, приводной модуль, MSK060C – 0600 – NN – S1 – UP1 – NNN, VT2000 – 52 / R900033828, MHD041B – 144 – PG1 – UN и т.д.
Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation Technology Forum,
“Smart Car “Hundred Forum” Issue 21 – China Automotive Semiconductor Technology Summit Forum”, AWC 2021 Third Automotive
Digital Cockpit Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers from
well-known industry companies, research institutions, universities and other industries with advanced technological advantages in the
field of intelligent connected vehicles and new energy vehicles to share their experience in the design, development and production of
intelligent connected vehicles. Problem solving and innovative technology; in future smart transportation, the relationship between cars,
software, data, environment, and ecology, and how car companies and suppliers can better work together to create future value.
The activities in the intelligent manufacturing and terminal application section are more abundant, including: Global Intelligent Manufacturing Academy,
NEPCON World Hardware Electronics Innovation Conference, ” NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar,
Internet of Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and innovation summit forum and 5G mobile
phone intelligent manufacturing industry chain summit, etc.
Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end Summit, Innovation and Opportunities,
Empowering Domestic Brands – 2021 Bay Area China Piezoelectric Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into
Cutting-edge Applications” Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.
330103-00-03-10-02-00 | Approach probe | New original
330100-50-05 | Preprocessor sensor | In stock
330100-90-05 | Preprocessor sensor | New original
330100-90-00 | Preprocessor sensor | In stock
3300/16 | Gap dual vibration monitor | In stock
3300/20-12-01-02-01-02 | Dual thrust position monitor | New original
31000-16-10-00-154-00-02 | 31000 close to probe housing | In stock
24765-03-01 | Expansion transducer assembly| New original
24765-02-01 | Enclosure extension transducer assembly | In stock
24765-02-00 | Enclosure extension transducer assembly | New original
24765-01-01 | Vibration monitor | In stock
2300/20-CN | Vibration monitor | New original
2300/20-00-00 | Vibration monitor | In stock
2300/20_KIT-001-00 | Condition monitoring system suite | New original
2300/20_KIT-001-02-00 | Condition monitoring system suite | In stock
2300/20-00 | Vibration monitor | New original
1900/65A-01-01-03-CN-00 | Universal device monitor | In stock
1900/65A-01-00-03-CN-01 | Universal Device monitor | New original
1900/65A-01-00-03-00-01 | Universal device monitor | In stock
1900/65A-00-01-01-CN-00 | Universal device monitor | In stock
1900/65A-00-01-03-00-00 | Universal Device monitor | New original
1900/65A-00-00-01-00-00 | Universal device monitor | In stock
330100-50-05 | Preprocessor sensor | New original
143416-01 | I/O module | In stock
143416-01 | Preprocessor sensor
18745-03 | Preprocessor sensor
177314-02 | Close to system test suite TK-3E
177314-01 | Close to system test suite TK-3E
177313-02-02 | Close to system test suite TK-3E
177313-02-01 | Close to system test suite TK-3E
135613-03-00 | High temperature enclosure expansion transducer assembly
135613-02-00 | High temperature enclosure expansion transducer assembly
177313-01-02 | Access to system test suite
135613-01-00 | High temperature enclosure expansion transducer assembly
2300/20_KIT-001-02-00 | Condition monitoring system suite
135613-01-00 | High temperature enclosure expansion transducer assembly
125840-02 | Ac power input module
126648-01 | External terminal
106M1079-01 | Ac power module
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