HIEE401481R0001 UAC326AE01 simulation module

Product parameters

Model: HIEE401481R0001 UAC326AE01

Brand: ABB

Size: 10cm x 10cm x 30cm

Weight: 1.2KG

Color: White Black

Working voltage: 5V

Working temperature: -10 ℃ to 50 ℃

Communication interface: RS232, RS485, CAN

Product specifications

Support for MODBUS protocol

Support hardware flow control

Using high-speed CMOS devices

Support for data caching

application area

HIEE401481R0001 UAC326AE01 is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.

HIEE401481R0001 UAC326AE01 is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals

Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment

Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc

Model: HIEE401481R0001 UAC326AE01 Brand: ABB Archive Function: Communication Function Product Certification: Qualified

Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type

Number of screens: 4 Imported or not: Yes Customized for processing: No

Alarm function: Product name: Module Input voltage: 24V Rated current: 5A

Special service: including postage. Remarks: one-year warranty. Operation method: remote control

Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut

Power voltage: 220V Input method: Current Input Material code: 65218

Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication

Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm

Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1

Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2

Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported

Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed

Third party communication products: ABB controllers available for sale in: nationwide

Product Instructions

Please install HIEE401481R0001 UAC326AE01 correctly on the device and connect the communication interface cable properly.

Please refer to the user manual for operating HIEE401481R0001 UAC326AE01 to ensure proper use.

Product Introduction

HIEE401481R0001 UAC326AE01 is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation
Technology Forum, ” Smart Car ” Hundred Forum ” Issue 21 –
China Automotive Semiconductor Technology Summit Forum ” , AWC 2021 Third Automotive Digital Cockpit
Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers
from well-known industry companies, research institutions, universities and other industries with advanced technological
advantages in the field of intelligent connected vehicles and new energy vehicles to share their experience in
the design, development and production of intelligent connected vehicles. Problem solving and innovative
technology; in future smart transportation, the relationship between cars, software, data, environment, and
ecology, and how car companies and suppliers can better
work together to create future value.

The activities in the intelligent manufacturing and terminal application section are more abundant, including:
Global Intelligent Manufacturing Academy, NEPCON World Hardware Electronics Innovation Conference,
“NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar, Internet of
Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and
innovation summit forum and 5G mobile phone intelligent manufacturing industry chain summit, etc.

Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end
Summit, Innovation and Opportunities, Empowering Domestic Brands – 2021 Bay Area China Piezoelectric
Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into Cutting-edge Applications”
Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.

Attendees will be able to listen closely to the sharing of big names in the industry, communicate with peers in the
industry, recharge themselves, and expand high-quality industry resources for enterprises.

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